Copper Paste for PCB Market Growth Analysis, Market Dynamics, Key Players and Innovations, Outlook and Forecast 2025-2031

The global Copper Paste for PCB market was valued at US$ 129.97 million in 2023 and is anticipated to reach US$ 177.65 million by 2030, witnessing a CAGR of 5.10% during the forecast period 2024-2030.

Copper paste for PCB (Printed Circuit Board) is a conductive paste that is used to fill voids or gaps in copper traces or to repair damaged copper traces on a PCB.

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Copper paste is typically made from a mixture of copper particles and a binder or carrier material, such as silicone or epoxy. It is applied to the PCB using a syringe or other dispensing tool and is then cured or sintered to create a conductive bond between the copper particles.

Japan market for Copper Paste for PCB is estimated to increase from $ 64.04 million in 2023 to reach $ 85.41 million by 2030, at a CAGR of 4.88% during the forecast period of 2024 through 2030.

China market for Copper Paste for PCB is estimated to increase from $ 27.08 million in 2023 to reach $ 41.83 million by 2030, at a CAGR of 6.87% during the forecast period of 2024 through 2030.

The major global manufacturers of Copper Paste for PCB include Sumitomo Metal Mining, Kyoto Elex, Tatsuta, Chang Sung Corporation, NAMICS, Mitsuboshi Belting, Asahi Solder, Heraeus, and Shoei Chemical, etc. in 2023, the world's top three vendors accounted for approximately 49.00% of the revenue.

This report aims to provide a comprehensive presentation of the global market for Copper Paste for PCB, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Copper Paste for PCB.

The Copper Paste for PCB market size, estimations, and forecasts are provided in terms of output/shipments (Kg) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Copper Paste for PCB market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Copper Paste for PCB manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

By Company

• Sumitomo Metal Mining

• Kyoto Elex

• Tatsuta

• Chang Sung Corporation

• NAMICS

• Mitsuboshi Belting

• Asahi Solder

• Heraeus

• Shoei Chemical

• Asahi Chemical

• Yuhon

• Copprint

• PrintCB

• Ampletec

Segment by Type

• Low Temperature Sintered

• Medium Temperature Sintered

• High Temperature Sintered

Segment by Application

• Consumer Electronics

• Communications

• Industrial/Medical

• Automotive

• Military/Aerospace

• Others

Production by Region

• North America

• Europe

• China

• Japan

• South Korea

Consumption by Region

• North America

• U.S.

• Canada

• Asia-Pacific

• China

• Japan

• South Korea

• China Taiwan

• Southeast Asia

• India

• Australia

• Europe

• Germany

• France

• U.K.

• Italy

• Spain

• Rest of Europe

• Latin America

• Mexico

• Brazil

• Argentina

• Middle East & Africa

• Israel

• GCC Countries

• Turkey

• South Africa

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