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  • Writer's picturesiddhesh kapshikar
    • Dec 6, 2023
    • 5 min read

Integrated Circuit Packaging Solder Ball Market, Global Outlook and Forecast 2023-2030

The global Integrated Circuit Packaging Solder Ball market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.


In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.


Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.


This report aims to provide a comprehensive presentation of the global market for Integrated Circuit Packaging Solder Ball, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Integrated Circuit Packaging Solder Ball. This report contains market size and forecasts of Integrated Circuit Packaging Solder Ball in global, including the following market information:

Global Integrated Circuit Packaging Solder Ball Market Revenue, 2018-2023, 2024-2030, ($ millions)

Global Integrated Circuit Packaging Solder Ball Market Sales, 2018-2023, 2024-2030, (M Units)

Global top five Integrated Circuit Packaging Solder Ball companies in 2022 (%)


The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.

Lead Solder Ball Segment to Reach $ Million by 2029, with a % CAGR in next six years.

The global key manufacturers of Integrated Circuit Packaging Solder Ball include Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology and Nippon Micrometal, etc. in 2022, the global top five players have a share approximately % in terms of revenue.

We surveyed the Integrated Circuit Packaging Solder Ball manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:

Global Integrated Circuit Packaging Solder Ball Market, by Type, 2018-2023, 2024-2030 ($ Millions) & (M Units)

Global Integrated Circuit Packaging Solder Ball Market Segment Percentages, by Type, 2022 (%)


  • Lead Solder Ball

  • Lead Free Solder Ball


Global Integrated Circuit Packaging Solder Ball Market, by Application, 2018-2023, 2024-2030 ($ Millions) & (M Units)

Global Integrated Circuit Packaging Solder Ball Market Segment Percentages, by Application, 2022 (%)


  • BGA

  • CSP & WLCSP

  • Flip-Chip & Others


Global Integrated Circuit Packaging Solder Ball Market, By Region and Country, 2018-2023, 2024-2030 ($ Millions) & (M Units)

Global Integrated Circuit Packaging Solder Ball Market Segment Percentages, By Region and Country, 2022 (%)


  • North America

  • US

  • Canada

  • Mexico

  • Europe

  • Germany

  • France

  • U.K.

  • Italy

  • Russia

  • Nordic Countries

  • Benelux

  • Rest of Europe

  • Asia

  • China

  • Japan

  • South Korea

  • Southeast Asia

  • India

  • Rest of Asia

  • South America

  • Brazil

  • Argentina

  • Rest of South America

  • Middle East & Africa

  • Turkey

  • Israel

  • Saudi Arabia

  • UAE

  • Rest of Middle East & Africa


Competitor Analysis

The report also provides analysis of leading market participants including:


  • Key companies Integrated Circuit Packaging Solder Ball revenues in global market, 2018-2023 (Estimated), ($ millions)

  • Key companies Integrated Circuit Packaging Solder Ball revenues share in global market, 2022 (%)

  • Key companies Integrated Circuit Packaging Solder Ball sales in global market, 2018-2023 (Estimated), (M Units)

  • Key companies Integrated Circuit Packaging Solder Ball sales share in global market, 2022 (%)


Further, the report presents profiles of competitors in the market, key players include:


  • Senju Metal

  • DS HiMetal

  • MKE

  • YCTC

  • Accurus

  • PMTC

  • Shanghai hiking solder material

  • Shenmao Technology

  • Nippon Micrometal

  • Indium Corporation

  • Jovy Systems

  • SK Hynix


Outline of Major Chapters:

Chapter 1: Introduces the definition of Integrated Circuit Packaging Solder Ball, market overview.

Chapter 2: Global Integrated Circuit Packaging Solder Ball market size in revenue and volume.

Chapter 3: Detailed analysis of Integrated Circuit Packaging Solder Ball manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 6: Sales of Integrated Circuit Packaging Solder Ball in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Global Integrated Circuit Packaging Solder Ball capacity by region & country.

Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 11: The main points and conclusions of the report.

Table of content

1 Introduction to Research & Analysis Reports 1.1 Integrated Circuit Packaging Solder Ball Market Definition 1.2 Market Segments 1.2.1 Market by Type 1.2.2 Market by Application 1.3 Global Integrated Circuit Packaging Solder Ball Market Overview 1.4 Features & Benefits of This Report 1.5 Methodology & Sources of Information 1.5.1 Research Methodology 1.5.2 Research Process 1.5.3 Base Year 1.5.4 Report Assumptions & Caveats 2 Global Integrated Circuit Packaging Solder Ball Overall Market Size 2.1 Global Integrated Circuit Packaging Solder Ball Market Size: 2022 VS 2030 2.2 Global Integrated Circuit Packaging Solder Ball Revenue, Prospects & Forecasts: 2018-2030 2.3 Global Integrated Circuit Packaging Solder Ball Sales: 2018-2030 3 Company Landscape 3.1 Top Integrated Circuit Packaging Solder Ball Players in Global Market 3.2 Top Global Integrated Circuit Packaging Solder Ball Companies Ranked by Revenue 3.3 Global Integrated Circuit Packaging Solder Ball Revenue by Companies 3.4 Global Integrated Circuit Packaging Solder Ball Sales by Companies 3.5 Global Integrated Circuit Packaging Solder Ball Price by Manufacturer (2018-2023) 3.6 Top 3 and Top 5 Integrated Circuit Packaging Solder Ball Companies in Global Market, by Revenue in 2022 3.7 Global Manufacturers Integrated Circuit Packaging Solder Ball Product Type 3.8 Tier 1, Tier 2 and Tier 3 I

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